We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Build-up Board.
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Build-up Board - Company Ranking(3 companyies in total)

Last Updated： Aggregation Period:Jul 16, 2025〜Aug 12, 2025
This ranking is based on the number of page views on our site.

Company Name Featured Products
Product Image, Product Name, Price Range overview Application/Performance example
松和産業 松和産業 本社
Build-up substrate
Build-up substrate

Other

 Efforts for Lightweight and Thin Design: Any Layer Substrate ■ Compatible with all-layer laser vias φ0.1 ■ Compatible with all-layer filled via plating ■ Achieved a thickness of 0.3mm for 4-layer builds ■ Achieved a thickness of 0.45mm for 6-layer builds ■ Achieved a thickness of 0.6mm for 8-layer builds *For more details, please refer to the PDF document or feel free to contact us. For more details, please refer to the PDF document or feel free to contact us.
Build-up substrate
Build-up substrate

Other

 【Build-Up Substrate Manufacturing Specifications Example (Excerpt)】 ■ 10-layer 3-4-3 build-up substrate with 0.4mm pitch BGA (filled via/stacked via specifications) - Board thickness: t1.6mm - BGA pad diameter: φ0.3mm - Resist opening: φ0.32mm - Laser hole diameter: φ0.1mm - Stacked vias using filled vias (via-on-via) - Core section 4-layer TH is resin-filled/covered with plating - L5/6 layer clearance φ0.35mm (TH φ0.2mm drill) *For more details, please refer to the related links or feel free to contact us. For more details, please refer to the related links or feel free to contact us.
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  1. 松和産業 松和産業 本社
    Featured Products
    Build-up substrateBuild-up substrate
    overview
    Efforts for Lightweight and Thin Design: Any Layer Substrate ■ Compatible with all-layer laser vias φ0.1 ■ Compatible with all-layer filled via plating ■ Achieved a thickness of 0.3mm for 4-layer builds ■ Achieved a thickness of 0.45mm for 6-layer builds ■ Achieved a thickness of 0.6mm for 8-layer builds *For more details, please refer to the PDF document or feel free to contact us.
    Application/Performance example
    For more details, please refer to the PDF document or feel free to contact us.
    Build-up substrateBuild-up substrate
    overview
    【Build-Up Substrate Manufacturing Specifications Example (Excerpt)】 ■ 10-layer 3-4-3 build-up substrate with 0.4mm pitch BGA (filled via/stacked via specifications) - Board thickness: t1.6mm - BGA pad diameter: φ0.3mm - Resist opening: φ0.32mm - Laser hole diameter: φ0.1mm - Stacked vias using filled vias (via-on-via) - Core section 4-layer TH is resin-filled/covered with plating - L5/6 layer clearance φ0.35mm (TH φ0.2mm drill) *For more details, please refer to the related links or feel free to contact us.
    Application/Performance example
    For more details, please refer to the related links or feel free to contact us.
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